The N201 redefines the boundaries of high-performance embedded modules with its breakthrough compact design. Within an ultra-slim form, it integrates multi-dimensional communication capabilities, supporting multi-mode access including 5G, Wi-Fi, and Ethernet, enabling seamless connection between devices and systems.

N203 breaks spatial constraints with extremely compact size, equipped with a multi-dimensional communication system supporting various connection methods. The platform is equipped with rich peripheral interfaces, allowing efficient integration with various industrial devices and sensors, providing flexible expansion capabilities for complex scenarios.

The N204 is born for highly precise coordination and real-time response. The platform is equipped with a real-time kernel, ensuring efficient and stable execution of motion control commands without latency, providing reliable underlying motion control assurance for robotics and automated equipment.

The N210 redefines the boundaries of embedded intelligent modules with its extremely compact size, integrating powerful multi-protocol communication capabilities within a limited space. It supports mainstream industrial bus and network protocols, achieving seamless collaboration and efficient interconnection between devices.

The N1000 redefines the performance density of high-end embedded intelligent modules. Within an extremely compact size, it integrates powerful computing performance and full-stack connectivity, providing a true "ready-from-the-start" core solution for high-end devices with stringent space requirements.

Real-time Xenomai kernel for extreme motion control demands；Comprehensive peripheral support: EtherCAT/multi-channel CAN FD/ high-speed 485/ SBUS.

Hard real-time core Xenomai for extreme motion control demands；Rich peripheral interfaces:EtherCAT / multi-channel CAN FD / high-speed RS485 / SBUS Multi-configuration communication options with high-speed Wi-Fi；Optional computing power: 160 TOPS to 320 TOPS

High AI computing power with domestic solutions, meeting the demands of large model operation； Efficient storage system for rapid processing of massive data； Rich interface options for perfect compatibility with various devices

Centered on a 12-core Arm high-performance processor, it delivers up to 300 TOPS of AI computing power, enabling swift operation response and effortlessly handling complex intelligent tasks. The module integrates superior AI computing units and toptier hardware components, coupled with massive storage capacity, ensuring sustained and stable system performance even under heavy workloads.

Featuring a dual 12-core ARM architecture and powerful computing performance of up to 500 TOPS, it provides a solid core for complex edge computing and AI tasks. Equipped with dual 16GB CPU memory and up to 160GB of dedicated AI memory, it ensures efficient parallel data processing and model inference. With industrial-grade reliability, it guarantees uncompromising data storage security.

Designed for mobile AI and edge intelligence deployments, it redefines the “computing backpack” concept. Integrating up to 1,000 TOPS of AI performance in a compact form, it ensures robust computing power follows wherever you go.

Exceptional image processing capabilities, enabling precise frame synchronization and efficient correction；Advanced encoding and compression technology, optimizing storage and transmission efficiency；Supports multi-channel data aggregation and high-speed bypass forwarding